Trade fair

SEMICON Europa 2022

Chips Powering The Data Age

Chips powering the data age: From November 15 – 18, Semicon Europa showcases innovations in mobility, medtech, advanced packaging, fab management, materials and sustainability.

Event start:
Event end:

Event location: Munich
Country: Germany

Innovations in cutting-edge technologies such as smart mobility, smart medtech, advanced packaging, fab management, materials and other semiconductor industry growth drivers will be in focus as visionaries and experts gather at Semicon Europa 2022, Messe München. Registration is now open.

Semicon Europa 2022 will take place at the same time as "electronica". Its motto is "Chips Powering the Data Age." Semicon Europa 2022 will highlight what challenges and opportunities arise from sustainability, workforce development and along the value chain as the semiconductor industry comes together to address these critical issues. SEMICON Europe 2022 is Europe's largest microelectronics event. It features an exhibition, conferences, forums and panel discussions.

First highlights of Semicon Europe is the opening ceremony where executives from Airbus, Athina, Edwards Vacuum, Imec, JCET Group, Porsche, Royal Philips, and Samsung will share their perspectives on key issues such as accelerating innovation, a sustainable and connected future and European manufacturing excellence.

At the Advanced Packaging Conference thought leaders will present advanced solutions for electronics packaging and test, manufacturing equipment and materials, design for reliability and test, and Heterogeneous Integration (HI).

In the Fab Management Forum experts will discuss topics such as chip manufacturing, datafication of fabs, and artificial intelligence in microelectronics manufacturing as the industry focuses more on long-term resilience strategies in light of Covid-19 and recent supply chain disruptions.

And at ITF Beyond 5G – powered by Imec, specialists will discuss radio frequency (RF) challenges and opportunities ranging from materials and devices to integrated circuits (ICs) and modules, as advanced chips and compound semiconductors pave the way to next-generation mobile connectivity.

Contact

Semi Europe

Helmholtzstr. 2 – 9, House D / 3rd floor
10587 Berlin
Germany

Welding with Civan's Ultrafast CBC-Laser: Basics, Opportunities and Challenges

The first part of the webinar will provide an overview of the fundamentals and challenges of the welding process and the features of the CIVAN CBC laser. The second part of the webinar will discuss approaches to take advantage of fast, arbitrary beam shaping to control process problems.

Register now

Digital tools or software can ease your life as a photonics professional by either helping you with your system design or during the manufacturing process or when purchasing components. Check out our compilation:

Proceed to our dossier

Welding with Civan's Ultrafast CBC-Laser: Basics, Opportunities and Challenges

The first part of the webinar will provide an overview of the fundamentals and challenges of the welding process and the features of the CIVAN CBC laser. The second part of the webinar will discuss approaches to take advantage of fast, arbitrary beam shaping to control process problems.

Register now

Digital tools or software can ease your life as a photonics professional by either helping you with your system design or during the manufacturing process or when purchasing components. Check out our compilation:

Proceed to our dossier