Features: various processing methods are combined into one station. Assembly techniques include micro welding, selective soldering by laser or hot bar and gluing (with subsequent UV or thermal curing) plus laser fine cutting. The large work area accommodates several processing stations with different joining and ablation methods. In this way, a complete device can be built up step-by-step without operator intervention. Feeders, belts and robots facilitate full automation while exchangeable grippers provide high versatility.

The motion system consists of high-precision stages with linear bearings, linear or brushless DC servo motors and optical position feedback. Rotary stages, curved rails and goniometers complement the linear motion to enable adjustment capability in all degrees of freedom. An optional gantry configuration provides superior repeatability over the entire work surface.

High resolution machine vision and multi-color LED illumination support the various process steps. Device-specific algorithms consist of a combination of multiple process steps (e. g. pattern matching, circular detection and edge detection), providing high recognition rates and minimizing process time.

The assembly techniques are determined by the requirements of the device. For instance, a component can be selectively soldered by laser onto a PC board, in the next step another part is laser welded and glued to it. In the last step, laser cutting will be used to remove fine supporting structures.