“Enabling the Technologies for Semicon”
Semiconductor chip manufacturing places high demands on each process step. Be inspired by expert talks from ASML, Zeiss, FormFactor, ACS and PI to discover solutions for the industry’s needs.
Today, semiconductor technology represents one of the most important industry sectors in the world. It paves the way for progress made in processor technology, data storage, signal processing, and opto-electronics and, therefore, enabling essential developments such as 6G technology, Internet of Things (IoT), or Electric and Autonomous Driving. At the same time, these growing markets are placing high demands on semiconductor manufacturers: Even smaller and more complex ICs with higher functional density, shorter innovation cycles, higher volumes, and the increasing cost pressure.
In our event “Enabling the Technologies for Semicon”, we want to bring together knowledge about market trends and developments in technology to fulfil the needs of industry and end customers.
As part of our digital event series, the “It's Possible Sessions”, you can expect fascinating presentations from experts on applications, requirements and solutions e.g. to increase throughput and precision in chip manufacturing.
Date: 30 November 2021 I Time: 8:00 a.m. & 2:00 p.m. UTC
- Welcome to the It’s Possible Sessions!
- Keynote: Pushing Boundaries – Together!
Markus Spanner I CEO I PI
- Keynote: The Relentless Pursuit of Precision at ASML
Steven Steen I Director of Product Management 3D Solutions I ASML
- Session 1: EUV Lithography in High Volume Manufacturing
Dr. Christian Karlewski I Lead Systems Engineer I Carl Zeiss SMT
- Session 2: Flexible Wafer-Level Optical Probing Solutions
Dan Rishavy I Director of Market Development I FormFactor
- Session 3: Solutions to Move Mo(o)re
Cliff Y. F. Huang I Head of Segment Marketing Semiconductor I PI
- Session 4: Maximizing SEMI Equipment Throughput With Motion Control Innovations
Jason Goerges I General Manager North America & Global VP of Marketing I ACS
- It’s Possible Conclusion & Goodbye