X-Fab und Smart Photonics entwickeln Multiterabit-Transceiver
Die Unternehmen integrieren ihre Silizium-Photonik-Plattform und InP-Chiplets mit Hilfe des Mikrotransferdrucks für die heterogene Integration und ermöglichen so neue Daten- und Telekommunikationsanwendungen.
InP technology supports modulator bandwidths exceeding 120 GHz, making it the optimal solution for next-generation multiterabit telecom and datacom standards – pushing transceiver speeds far into the terabit realm. In contrast, market leading silicon photonics technologies hit a performance ceiling at around 70 GHz. The collaboration aims to deliver scalable, high-volume solutions that combine the best of both technologies.
By co-optimizing silicon photonics, InP, and microtransfer printing (MTP) technologies to fulfill customer requirements, the collaboration will enable new functionalities and improved system performance while reducing integration costs through relaxed photonics packaging requirements. The MTP technology, licensed from X-Celeprint, enables a broad degree of freedom for the system and product designers, by providing flexible integration of various material system chiplets into the product design.
Johan Feenstra, CEO of Smart Photonics, explains: “I am very pleased that we were able to establish a strategic collaboration with X-Fab to unite the strengths of our platforms through world-class heterogeneous integration. As the demand for integrated photonics rapidly increases, thanks to the growth of AI and data transfer, our joint solutions will enable much faster data rates while reducing overall power consumption, and therefore the environmental footprint.”
Rudi De Winter, CEO of X-Fab, adds: “Through heterogeneous integration, we are combining the best of the InP and silicon photonics worlds. This will allow our customers to develop innovative solutions addressing the societal challenges of our times such as decarbonization. It is also a great opportunity to build a strong European value chain.”
This collaboration builds upon the PhotonixFAB EU funding project, which aims to provide a path to scalable high-volume manufacturing for SOI and SiN silicon photonics, MTP-ready InP chiplets and microtransfer printing of chiplets.
The companies recently signed a memorandum of understanding to formalize their collaboration. The aim is to support lead customers with industrial prototyping by 2026, with risk production readiness by 2027. Early customer engagements can be supported within the ongoing PhotonixFAB project framework.
