Designed with Teledyne e2v’s proprietary CMOS technology, Hydra3D+ features a new 10 µm three-tap pixel which provides very fast transfer times – starting from 10 ns – and displays high sensitivity in the NIR wavelength, alongside improved demodulation contrast. This precise combination enables the sensor to operate in real-time without motion artefacts – even if there are fast moving objects in the scene – and with excellent temporal noise at short ranges, essential in applications such as pick and place, logistics, factory automation and factory safety. An innovative on-chip multisystem management feature enables the sensor to work alongside multiple active systems without interference which can lead to false measurements.
The excellent sensitivity of Hydra3D+ enables it to effectively manage lighting power and handle a wide range of reflectivity. Its high 832 × 600 pixel resolution, with powerful on-chip HDR, featuring an on-the-fly flexible configuration, enables the best trade-off between application-level parameters, such as distance range, object reflectivity, frame rate etc. This makes it ideal for mid, long-range distances and/or outdoor applications such as automated guided vehicles, surveillance, ITS and building construction.
The sensor has been thoughtfully designed for customers seeking real-time and flexible 3D detection with uncompromised 3D performance. It offers large field-of-view scenes captured in both 2D and 3D by a compact sensor which makes the system very cost effective.
Ha Lan Do Thu, marketing manager for 3D imaging at Teledyne e2v said, “Today, many time-of-flight sensors suffer from motion artefacts and can’t instantly perform in changing operating conditions. With Hydra3D+, our customers can easily achieve reliable 3D measurement with the highest levels of 3D performance, uncompromised image quality in both 2D and 3D modes, and in all distance ranges and conditions even where multiple systems operate or in outdoor environments.”
