A photon assisted coherent quantum phase slip effect reveals the formation of current steps.

Continuous growth thanks to constant demand for cooling of electronic components.

Teledyne e2v releases a new time-of-flight CMOS image sensor which is tailored for versatile 3D detection and measurement, Hydra3D+.

LightFab, Bartels Mikrotechnik, and Miltenyi Biotec cooperated with the Fraunhofer ILT on producing high-resolution microcomponents by photo-crosslinking.

The spin-out company from the University of Glasgow will further commercialize its unique PCSEL laser technology.

New device is capable of streaming video at 12,000 frames per second using light modulation.

EMVA: Submit research and innovation contributions now! Deadline is May 2, 2023.

12 experimental projects were successful in the open call for second technology transfer experiments addressing laser-based advanced and additive manufacturing.