Automated testing of MEMS at the wafer level
In order to keep the production costs for MEMS low while at the same time maintaining a high yield and high quality, automated testing at the wafer level before the chips are separated is proving its worth more and more
By default, this is done through electrical testing procedures. However, certain test and inspection tasks require a direct, mostly optical measurement of the mechanical function of the delicate structures of the micro-electromechanical systems (MEMS).
The optical measuring devices for micro system technology from Polytec, so-called MSA Micro System Analyzers, are designed in such a way that they can be easily integrated into almost all commercially available wafer probers. The combination of a (semi-)automatic probe station and a microscope-based MSA-600 scanning laser vibrometer enables efficient and fast measurement of the dynamic behavior of MEMS components - and that directly on the wafer in series. MSA from Polytec therefore help to detect rejects early, monitor process stability and maximize yield. This makes them an efficient testing tool for the production process and ensures high profits for the MEMS producer.
